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G01400 - SEMI G14 - Guideline for Specifying the Dimensions and Tolerances Used to Manufacture Plastic Molded Dip Package Tooling Revision:SEMI G14-88 - Inactive SEMI MF1451-0707 (Reapproved 0512)

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Description

SEMI MF1451-0707 (Reapproved 0512)

org September 2002

ISO 11462) for obtaining reliable

SEMI E117 — Specification for Reticle Load Port

The scope of this Standard is limited to the usage and description of interbay and intrabay AMHS transport equipment (OHT

G01400 - SEMI G14 - Guideline for Specifying the Dimensions and Tolerances Used to Manufacture Plastic Molded Dip Package Tooling Revision:SEMI G14-88 - Inactive SEMI MF1451-0707 (Reapproved 0512)NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. This Document is a guideline for the ordering of tooling required to mold and form plastic molded DIP semiconductor packages. It is to be used by packaging engineers, mold manufacturers, and end of line tool makers as the

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