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SEMI G9-80 (first published)
this Guide describes setting targets for
本安全ガイドラインは，以下の内容が記載されている：
Stepper & Tracks)
That is to say
G03700 - SEMI G37 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded Small Outline Package Tooling StdPbc-0615 SEMI G9-80 (first published)This document is a guideline for the ordering of tooling required to mold and form plastic molded small outline semiconductor packages. It is to be used by packaging engineers, mold manufacturers, and end of line toolmakers as the basis for defining the limits of manufacturing tolerances. Referenced SEMI Standards None.
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