G08200 - SEMI G82 - Specification for 300 mm Load Port for Frame Cassettes in Backend Process Revision:SEMI G82-0301E (Reapproved 0706) - Superseded 1 This Standard defines and

1  This Standard defines and describes the electrical

This Test Method is used to measure die strength for dies from processed wafers

Bonding wire

The wafer coordinate system can be used to establish the coordinates of each point of interest

SEMI F78-0611 (technical revision)

G08200 - SEMI G82 - Specification for 300 mm Load Port for Frame Cassettes in Backend Process Revision:SEMI G82-0301E (Reapproved 0706) - Superseded 1 This Standard defines andThis Specification defines dimensional requirements for the load port of frame cassette for 300 mm wafer in backend process equipment. It is intended to promote a uniform physical interface between equipment and the factory, to facilitate the use of automated frame cassette transport systems, and or to meet ergonomic requirements for manually loaded equipment. This is a Standard covering equipment for 300 mm frame cassette only. Referenced SEMI