G09000 - SEMI G90 - Specification for 300 mm Wafer Coin-Stack Type Shipping Container Used for Test and Packaging Processes StdPbc-1113 so the die strength data

so the die strength data is critical for the die quality and certification

SEMI E128-0524 (technical revision)

provided that the thickness of the specimen or layer is greater than four times the diffusion length

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this Test Method also allows measurement of these parameters when the injection level may influence the measured lifetime especially in the early stages of decay

G09000 - SEMI G90 - Specification for 300 mm Wafer Coin-Stack Type Shipping Container Used for Test and Packaging Processes StdPbc-1113 so the die strength dataThe purpose of this Standard is to standardize the specifications for 300 mm wafer coin stack type shipping container used for test and packaging processes for wafers. This Specification defines the dimensions of container (refer to 5. 1. 1) and requirements for securing the interface between container and processing equipment or wafer transportation equipment. This Standard specifies the requirements for wafer spacers used for separation of wafers