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SEMI MF1390-02 (first SEMI publication)
comparison
and a thickness of 700 µm
SEMI G87-1108 (Reapproved 0215)
1 — Specification for SECS-II Support for Processing Management
G08800 - SEMI G88 - Specification for Tape Frame for 450 mm Wafer Revision:SEMI G88-0211 - Superseded SEMI MF1390-02 (first SEMI publication)The purpose of this Document is to standardize the specifications for 450 mm wafer tape frames used between the dicing process and the die bonding process, and also used for shipping and handling. This Standard is applicable to 450 mm wafer tape frames. This Standard documents the dimensions, characteristics, and measurement methods for 450 mm wafer tape frames. This Standard can be used as the specification sheet for tape frame upon purchasing.
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