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SEMI 3D3-0613 (first published)
SEMI標準文件所處理。
本スタンダードは数種類の
Provide a common language to express the needs and evaluation methods of
本テスト方法はフラットパネルディスプレイ（
3D01000 - SEMI 3D10 - Guide to Describing Materials Properties for Intermediate Wafers for Use in a 300 mm 3DS-IC Wafer Stack StdDcs-Superseded SEMI 3D3-0613 (first published)1 Purpose 1. 1 This Guide is intended to address the needs of the 3D Stacked IC (3DS IC) industry by providing the tools needed to procure processed wafers to be used in a 3DS IC process. 2 Scope 2. 1 This Guide provides the tools to describe individual wafers in a 3DS IC process. In particular, this Document provides direction for describing the dimensions, materials, and devices for wafers that have undergone processing and are entering 3D stacking
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