3D01300 - SEMI 3D13 - Guide for Measuring Voids in Bonded Wafer Stacks StdTpc-3DS-IC This specification establishes a set

This specification establishes a set of standards to assist in specifying and ordering large area masks for the Flat Panel Display industry

This Guide will assist users in selection and use of bond-void metrology equipment and a protocol for performing bond-void measurements based on their application

SEMI C47-0706 (complete rewrite)

対向基板やカラーフィルタ基板に用いられるガラス基板のうち，まだ，成膜が施されていないベアーガラス基板

SEMI D46-0525 (technical revision)

3D01300 - SEMI 3D13 - Guide for Measuring Voids in Bonded Wafer Stacks StdTpc-3DS-IC This specification establishes a setThis Guide will assist users in selection and use of bond void metrology equipment and a protocol for performing bond void measurements based on their application. New bonding processes and applications are sensitive to significantly smaller voids than bonding processes currently used for 3DS IC package sealing. This Guide is based on experimental data on 300 mm diameter silicon wafer pairs. The inspection and metrology tools covered include only