G08700 - SEMI G87 - Specification for Plastic Tape Frame for 300 mm Wafer StdPbc-0611 This Document also provides guidelines

This Document also provides guidelines for grades of phosphoric etchants for which a need has been identified

SEMI MF1727-1110 (Reapproved 0322)

The user might use this document to check significant performance characteristics

consumer가 각각의 목적에 따라 관련된 데이터를 그룹화 하는 메커니즘을 포함한다

This Standard does not define terms which have been defined already in other referenced Standards

G08700 - SEMI G87 - Specification for Plastic Tape Frame for 300 mm Wafer StdPbc-0611 This Document also provides guidelinesThe purpose of this Document is to standardize the specification of a plastic tape frame, for a 300 mm wafer, which is used between the dicing process and the die bonding process, and for the handling and shipping of wafers. This Specification is applicable to plastic tape frames for 300 mm wafers. This Standard puts in writing the dimensions, mechanical characteristics and measurement method for the 300 mm wafer tape frame. This Standard can be used