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The edges of circular wafers of electronic materials are frequently required to be shaped after cutting the wafers from the ingot
SEMI E83-0714 (technical revision)
SEMI F61 — Guide for Ultrapure Water System Used in Semiconductor Processing
This Document describes the data items that relate to electronic substrate mapping
and strength of pellicle films used for masks
M06800 - SEMI M68 - Test Method for Determining Wafer Near-Edge Geometry from a Measured Height Data Array Using a Curvature Metric, ZDD Revision:SEMI M68-0720 - Current The edges of circular wafersWafer near edge geometry can significantly affect the yield of semiconductor device processing. Knowledge of near edge geometrical properties can help the producer and consumer determine if the dimensional characteristics of a specimen wafer satisfy given geometrical requirements. The metric, ZDD, quantifies the near edge curvature of wafers used in semiconductor device processing. Consideration should be given to the use of this or other proposed
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