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so the die strength data is critical for the die quality and certification
It may be applied to subsystems of other multi-resource equipment
after which raw silicon wafers are transferred to another carrier at device makers
using a differential mobility analyzer (DMA)
SEMI G69-0996 (Reapproved 0318)
M07100 - SEMI M71 - Specification for Silicon-on-Insulator (SOI) Wafers for CMOS LSI StdPbc-1113 so the die strength data1 Purpose 1. 1 This Specification defines thin layer silicon on insulator (SOI) wafer requirements for CMOS large scale integrated circuit (LSI) devices. In the case of 200 and 300 mm wafers this Specification is targeted for nodes from 130 to 14 nm. In the case of 150 mm wafers, older LSI generations are included as well. By defining parameters, inspection procedures and acceptance criteria, both suppliers and customers may uniformly define product
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